Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Tae-Joo Hwang, Tae Hong Min, Young Kun Jee, Sang-Uk Han | 2018-07-10 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Tae-Joo Hwang, Tae Hong Min, Young Kun Jee, Sang-Uk Han | 2017-08-01 |