Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842972 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2023-12-12 |
| 11553118 | Imaging apparatus, manufacturing method therefor, and electronic apparatus | Katsuji Kimura, Fumihiko Hanzawa | 2023-01-10 |
| 11355462 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2022-06-07 |
| 10818628 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2020-10-27 |
| 10522494 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2019-12-31 |
| 10090351 | Semiconductor device having gaps within the conductive parts | Hiroaki ASHIDATE | 2018-10-02 |
| 9935232 | Method of manufacturing semiconductor device | Gen Toyota, Shouta Inoue, Susumu Yamamoto, Takamasa Tanaka, Takamitsu Yoshida | 2018-04-03 |
| 9831204 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2017-11-28 |
| 9761463 | Semiconductor device and semiconductor device manufacturing method | Takamitsu Yoshida, Kuniaki Utsumi, Atsuko Kawasaki | 2017-09-12 |
| 9721865 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2017-08-01 |
| 9679867 | Semiconductor device having a low-adhesive bond substrate pair | Hiroaki ASHIDATE | 2017-06-13 |
| 9165962 | Solid state imaging device | — | 2015-10-20 |
| 9117774 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2015-08-25 |
| 9004337 | System and method for manufacturing semiconductor device | Satoshi Hongo, Kenji Takahashi | 2015-04-14 |
| 8980671 | Semiconductor device and manufacturing method of semiconductor device | Satoshi Hongo, Akihiro Hori, Kenji Takahashi, Hideo Numata | 2015-03-17 |
| 8822307 | Semiconductor manufacturing apparatus and semiconductor manufacturing method | Naoko Yamaguchi, Hideo Numata, Satoshi Hongo, Kenji Takahashi | 2014-09-02 |
| 8778778 | Manufacturing method of semiconductor device, semiconductor substrate, and camera module | Masahiro Sekiguchi, Masayuki Dohi, Tsuyoshi Matsumura, Hideo Numata, Mari Otsuka +3 more | 2014-07-15 |
| 8754535 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2014-06-17 |
| 8748316 | Method of manufacturing semiconductor device, semiconductor device, and camera module | Takashi Shirono, Mie Matsuo, Hideo Numata, Tsuyoshi Matsumura | 2014-06-10 |
| 8704337 | Semiconductor device and method for manufacturing the same | Eiji Takano, Hideo Numata | 2014-04-22 |
| 8609511 | Semiconductor device manufacturing method, semiconductor device, and camera module | Takashi Shirono, Naoko Yamaguchi, Satoshi Hongo, Tsuyoshi Matsumura | 2013-12-17 |
| 8552545 | Manufacturing method for semiconductor device, semiconductor device and semiconductor chip | Mitsuo Umemoto, Yukiharu Akiyama | 2013-10-08 |
| 8426977 | Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module | Hideko Mukaida, Susumu Harada, Chiaki Takubo | 2013-04-23 |
| 8404586 | Manufacturing method for semiconductor device | Mitsuo Umemoto, Yukiharu Akiyama | 2013-03-26 |
| 8405227 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2013-03-26 |