Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8338904 | Semiconductor device and method for manufacturing the same | Chiaki Takubo, Hideo Numata, Yoshihisa Imori | 2012-12-25 |
| 8309430 | Semiconductor manufacturing apparatus and semiconductor manufacturing method | Naoko Yamaguchi, Satoshi Hongo, Chiaki Takubo, Hideo Numata | 2012-11-13 |
| 8269315 | Semiconductor device and method of manufacturing semiconductor device | Masahiro Sekiguchi, Kenji Takahashi | 2012-09-18 |
| 8237285 | Semiconductor device, through hole having expansion portion and thin insulating film | Mie Matsuo, Masahiro Sekiguchi, Chiaki Takubo | 2012-08-07 |
| 8228426 | Semiconductor package and camera module | Mie Matsuo, Atsuko Kawasaki, Kenji Takahashi, Masahiro Sekiguchi | 2012-07-24 |
| 8089163 | Semiconductor device production method and semiconductor device | Yoshihiko Nemoto, Mitsuo Umemoto | 2012-01-03 |
| 8063462 | Semiconductor device and method of manufacturing the same | Masahiro Sekiguchi, Susumu Harada | 2011-11-22 |
| 7928581 | Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same | Osamu Miyata | 2011-04-19 |
| 7888778 | Semiconductor device and producing method of the same | Masahiro Sekiguchi, Ninao Sato, Kenji Takahashi | 2011-02-15 |
| 7888760 | Solid state imaging device and method for manufacturing same, and solid state imaging module | Hitoshi Sugiyama, Atsuko Yamashita, Kazutaka Akiyama, Susumu Harada, Masahiro Sekiguchi +4 more | 2011-02-15 |
| 7808064 | Semiconductor package including through-hole electrode and light-transmitting substrate | Atsuko Kawasaki, Mie Matsuo, Ikuko Inoue, Masayuki Ayabe, Masahiro Sekiguchi | 2010-10-05 |
| 7638421 | Manufacturing method for semiconductor device and semiconductor device | Yoshihiko Nemoto, Mitsuo Umemoto | 2009-12-29 |
| 7598613 | Flip chip bonding structure | Osamu Miyata | 2009-10-06 |
| 7456502 | Wiring board with connection electrode formed in opening and semiconductor device using the same | Osamu Miyata | 2008-11-25 |
| 7452751 | Semiconductor device and method of manufacturing the same | Yoshihiko Nemoto, Kenji Takahashi | 2008-11-18 |
| 7432196 | Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device | Yoshihiko Nemoto, Kenji Takahashi | 2008-10-07 |
| 7416963 | Manufacturing method of semiconductor device | Mitsuo Umemoto, Yoshio Okayama, Hiroshi Terao, Yoshihiko Nemoto | 2008-08-26 |
| 7405485 | Semiconductor device | Tadahiro Morifuji, Osamu Miyata | 2008-07-29 |
| 7306972 | Semiconductor device and manufacturing method of the same | Mitsuo Umemoto | 2007-12-11 |
| 7282444 | Semiconductor chip and manufacturing method for the same, and semiconductor device | Mitsuo Umemoto, Yoshihiko Nemoto, Kenji Takahashi | 2007-10-16 |
| 7259454 | Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device | Yoshihiko Nemoto, Kenji Takahashi | 2007-08-21 |
| 7253527 | Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device | Yoshihiko Nemoto, Naotaka Tanaka | 2007-08-07 |
| 7235428 | Semiconductor device production method | Yoshihiko Nemoto, Mitsuo Umemoto | 2007-06-26 |
| 7227262 | Manufacturing method for semiconductor device and semiconductor device | Yoshihiko Nemoto, Mitsuo Umemoto | 2007-06-05 |
| 7169639 | Semiconductor device manufacturing method | Mitsuo Umemoto | 2007-01-30 |