Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057362 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2024-08-06 |
| 11842972 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2023-12-12 |
| 11355462 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2022-06-07 |
| 11069591 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2021-07-20 |
| 10818628 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2020-10-27 |
| 10522494 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2019-12-31 |
| 10431516 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2019-10-01 |
| 9831204 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2017-11-28 |
| 9721865 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2017-08-01 |
| 9601441 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2017-03-21 |
| 9312228 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2016-04-12 |
| 9117774 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2015-08-25 |
| 9111819 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2015-08-18 |
| 8928156 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2015-01-06 |
| 8786106 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2014-07-22 |
| 8754535 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2014-06-17 |
| 8723339 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Masaki Kasai | 2014-05-13 |
| 8664779 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Masaki Kasai | 2014-03-04 |
| 8659174 | Semiconductor device | Shingo Higuchi | 2014-02-25 |
| 8653657 | Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device | Tadahiro Morifuji | 2014-02-18 |
| 8575764 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2013-11-05 |
| 8432046 | Semiconductor device | Shingo Higuchi | 2013-04-30 |
| 8405227 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Kazumasa Tanida | 2013-03-26 |
| 8164201 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Masaki Kasai | 2012-04-24 |
| 8063495 | Semiconductor device | Shingo Higuchi | 2011-11-22 |