Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928581 | Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same | Kazumasa Tanida | 2011-04-19 |
| 7714448 | Semiconductor device and method for manufacturing semiconductor device | Masaki Kasai, Shingo Higuchi | 2010-05-11 |
| 7688008 | Lighting lamp | Daisuke Uchida, Toshiyuki Kondo | 2010-03-30 |
| 7598613 | Flip chip bonding structure | Kazumasa Tanida | 2009-10-06 |
| 7518230 | Semiconductor chip and semiconductor device | Tadahiro Morifuji | 2009-04-14 |
| 7456049 | Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same | — | 2008-11-25 |
| 7456502 | Wiring board with connection electrode formed in opening and semiconductor device using the same | Kazumasa Tanida | 2008-11-25 |
| 7436063 | Packaging substrate and semiconductor device | Shingo Higuchi | 2008-10-14 |
| 7405485 | Semiconductor device | Kazumasa Tanida, Tadahiro Morifuji | 2008-07-29 |
| 7224049 | Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same | — | 2007-05-29 |
| 6717278 | Semiconductor device having a resist edge positioned over througholes | Ichirou Kishimoto | 2004-04-06 |
| 6607135 | Module for IC card, IC card, and method for manufacturing module for IC card | Minoru Hirai, Shigeyuki Ueda, Tomoharu Horio | 2003-08-19 |
| 6541844 | Semiconductor device having substrate with die-bonding area and wire-bonding areas | Ichirou Kishimoto | 2003-04-01 |
| 6479948 | Starting device for discharge lamp | Youichi Yamamoto, Hisao Hirata | 2002-11-12 |
| 6467941 | Vehicle lighting unit | Hisao Hirata, Yasuhisa Yaguchi, Kunio Iwaki, Isamu Satoh | 2002-10-22 |
| 6458609 | Semiconductor device and method for manufacturing thereof | Junichi Hikita, Kazutaka Shibata, Tsunemori Yamaguchi, Tadahiro Morifuji | 2002-10-01 |
| 6404142 | Starting device for discharge lamp | Hisao Hirata | 2002-06-11 |
| 6308894 | IC module, method of manufacturing the same and IC card provided with IC module | Minoru Hirai, Shigeyuki Ueda, Tomoharu Horio | 2001-10-30 |
| 6207473 | Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card | Minoru Hirai, Shigeyuki Ueda, Tomoharu Horio | 2001-03-27 |
| 6204564 | Semiconductor device and method for making the same | Kazutaka Shibata, Shigeyuki Ueda | 2001-03-20 |
| 6160526 | IC module and IC card | Minoru Hirai, Shigeyuki Ueda, Tomoharu Horio | 2000-12-12 |
| 6133637 | Semiconductor device having a plurality of semiconductor chips | Junichi Hikita, Kazutaka Shibata, Tsunemori Yamaguchi, Tadahiro Morifuji | 2000-10-17 |
| 5672550 | Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame | Masahiro Tsuji | 1997-09-30 |
| 5297585 | Room temperature shrinkable tube | Hiroyuki Andou, Norio Adachi | 1994-03-29 |
| 5055993 | Invertor apparatus | Katsunori Kawano, Youji Oki | 1991-10-08 |