Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6717278 | Semiconductor device having a resist edge positioned over througholes | Osamu Miyata | 2004-04-06 |
| 6541844 | Semiconductor device having substrate with die-bonding area and wire-bonding areas | Osamu Miyata | 2003-04-01 |