Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7961918 | Personal identification device and electronic apparatus provided therewith | Yoshihiro Ikefuji | 2011-06-14 |
| 7589415 | Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip | Kazutaka Shibata, Shigeyuki Ueda | 2009-09-15 |
| 7307349 | Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface | Yoshikazu Nakagawa, Koji Yamamoto | 2007-12-11 |
| 7226336 | Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips | Ikuo Yoshida, Kazuhide Ino | 2007-06-05 |
| 7126226 | Semiconductor device and semiconductor chip for use therein | Hiroo Mochida | 2006-10-24 |
| 7088983 | Semiconductor device for radio communication device, and radio communication device using said semiconductor device | Hiroo Mochida, Katsutoshi Nagi | 2006-08-08 |
| 7045386 | Semiconductor device and semiconductor chip for use therein | Hiroo Mochida | 2006-05-16 |
| 7045900 | Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device | Goro Nakatani, Nobuhisa Kumamoto, Katsumi Sameshima, Kazutaka Shibata, Shigeyuki Ueda | 2006-05-16 |
| 7009294 | Production process for semiconductor device | Kazutaka Shibata, Shigeyuki Ueda | 2006-03-07 |
| 6965166 | Semiconductor device of chip-on-chip structure | Yoshikazu Nakagawa, Koji Yamamoto | 2005-11-15 |
| 6897091 | Semiconductor device and manufacturing method thereof | Yoshikazu Nakagawa, Nobuhisa Kumamoto | 2005-05-24 |
| 6869829 | Semiconductor chip, chip-on-chip structure device, and assembling method thereof | Koji Yamamoto, Isamu Nishimura, Nobuhisa Kumamoto | 2005-03-22 |
| 6842859 | Authentication system, authentication device, authentication data producing device, and authentication method | Yoshihiro Ikefuji, Shigemi Chimura | 2005-01-11 |
| 6838312 | Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips | Koji Yamamoto | 2005-01-04 |
| 6747546 | Data communication transponder and communications system employing it | Haruo Taguchi, Yoshihiro Ikefuji | 2004-06-08 |
| 6742117 | IC card and method of using IC card | Yoshihiro Ikefuji, Toyokazu Komuro | 2004-05-25 |
| 6724084 | Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device | Goro Nakatani, Nobuhisa Kumamoto, Katsumi Sameshima, Kazutaka Shibata, Shigeyuki Ueda | 2004-04-20 |
| 6724296 | Communications system having an authentication function | Haruo Taguchi, Yoshihiro Ikefuji | 2004-04-20 |
| 6717244 | Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips | Koji Yamamoto | 2004-04-06 |
| 6696347 | Production process for semiconductor device | Kazutaka Shibata, Shigeyuki Ueda | 2004-02-24 |
| 6679424 | Non contact type IC card | Yoshihiro Ikefuji, Shigemi Chimura, Haruo Taguchi | 2004-01-20 |
| 6657309 | Semiconductor chip and semiconductor device of chip-on-chip structure | Katsumi Sameshima | 2003-12-02 |
| 6635512 | Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips | Ikuo Yoshida, Kazuhide Ino | 2003-10-21 |
| 6617693 | Semiconductor device and semiconductor chip for use therein | Hiroo Mochida | 2003-09-09 |
| 6534847 | Semiconductor device | Hiroo Mochida | 2003-03-18 |