| 9917010 |
Semiconductor device manufacturing method |
Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Horinaka |
2018-03-13 |
| 9905497 |
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
Takeshi Susaki, Masahito Shindo |
2018-02-27 |
| 9171761 |
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
Takeshi Sasaki, Masahiro Shindo |
2015-10-27 |
| 8736047 |
Semiconductor device and manufacturing method thereof |
Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Horinaka |
2014-05-27 |
| 8704342 |
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
Takeshi Sasaki, Masahiro Shindo |
2014-04-22 |
| 7326041 |
Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
Isao Ochiai |
2008-02-05 |
| 6724072 |
Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
Isao Ochiai |
2004-04-20 |