Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466994 | Mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargeable battery including mobile terminal power receiving module | Hiroshi Yamazaki, Eiji Toyoda, Hajime Sunahara | 2016-10-11 |
| 9165898 | Method of manufacturing semiconductor device with through hole | Akira Suzuki, Yoshio Okayama, Mitsuo Umemoto | 2015-10-20 |
| 8154129 | Electrode structure and semiconductor device | Kikuo Okada, Takahiro Oikawa | 2012-04-10 |
| 7906430 | Method of manufacturing a semiconductor device with a peeling prevention layer | Mitsuo Umemoto, Akira Suzuki | 2011-03-15 |
| 7820548 | Semiconductor device and manufacturing method thereof | Akira Suzuki | 2010-10-26 |
| 7759247 | Manufacturing method of semiconductor device with a barrier layer and a metal layer | Akira Suzuki, Yoshio Okayama | 2010-07-20 |
| 7670955 | Semiconductor device and manufacturing method of the same | Akira Suzuki, Mitsuo Umemoto | 2010-03-02 |
| 7659576 | Semiconductor device and method of manufacturing the same | Kikuo Okada | 2010-02-09 |
| 7646100 | Semiconductor device with penetrating electrode | Akira Suzuki, Mitsuo Umemoto | 2010-01-12 |
| 7582971 | Semiconductor device and manufacturing method of the same | Akira Suzuki, Mitsuo Umemoto | 2009-09-01 |
| 7495881 | Chucking method and processing method using the same | Akira Suzuki, Yoshio Okayama, Mitsuo Umemoto | 2009-02-24 |
| 7485967 | Semiconductor device with via hole for electric connection | Akira Suzuki, Yoshio Okayama, Mitsuo Umemoto | 2009-02-03 |
| 7382037 | Semiconductor device with a peeling prevention layer | Mitsuo Umemoto, Akira Suzuki | 2008-06-03 |
| 7339273 | Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode | Akira Suzuki, Mitsuo Umemoto | 2008-03-04 |
| 7256420 | Semiconductor device and manufacturing method thereof | Akira Suzuki | 2007-08-14 |