Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10212803 | Circuit board and circuit board assembly | Myung Sam Kang, Jung Han Lee, Young Gwan Ko | 2019-02-19 |
| 10153255 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2018-12-11 |
| 10109588 | Electronic component package and package-on-package structure including the same | Sung Won Jeong, Young Gwan Ko, Myung Sam Kang | 2018-10-23 |
| 10090278 | Semiconductor packages | Sang-Sick Park, Geol Nam, Jihwan Hwang | 2018-10-02 |
| 10064291 | Circuit board and manufacturing method thereof | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2018-08-28 |
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Yeong-Hwan Choe, Tae-Joo Hwang, Young Kun Jee, Sang-Uk Han | 2018-07-10 |
| 10015877 | Circuit board comprising heat transfer structure | Myung Sam Kang, Jin Hyuk JANG, Young Gwan Ko | 2018-07-03 |
| 9992865 | Circuit board and assembly thereof | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2018-06-05 |
| 9945911 | Apparatus and method for measuring impedance for fuel cell diagnosis | — | 2018-04-17 |
| 9899136 | Coil component and method of manufacturing the same | Sa Yong Lee, Myung Sam Kang, Seon Ha Kang, Mi Sun Hwang, Il Jong Seo | 2018-02-20 |
| 9832856 | Circuit board | Myung Sam Kang, Young Gwan Ko | 2017-11-28 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Young Kun Jee, Sang-Uk Han | 2017-08-01 |
| 9699885 | Circuit board including heat dissipation structure | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2017-07-04 |
| 9655229 | Circuit board | Myung Sam Kang, Young Gwan Ko | 2017-05-16 |
| 9589947 | Semiconductor packages and methods of manufacturing the same | Jihwan Hwang, Young Kun Jee, Jung-Hwan Kim, Kwang-chul Choi | 2017-03-07 |
| 9543276 | Chip-stacked semiconductor package | Young Kun Jee, Sun-kyoung Seo | 2017-01-10 |
| 9324683 | Semiconductor package and method of manufacturing the same | Young Kun Jee, Tae-Je Cho | 2016-04-26 |
| 9202767 | Semiconductor device and method of manufacturing the same | Ji Hwang Kim, Kwang-chul Choi, Sangwon Kim | 2015-12-01 |
| 9196505 | Semiconductor device and method of forming the same | Un-Byoung Kang, Kwang-chul Choi, Jung-Hwan Kim, Hojin Lee, Minseung Yoon | 2015-11-24 |
| 9099541 | Method of manufacturing semiconductor device | Ji Hwang Kim, Sunpil Youn, Sangwon Kim, Kwang-chul Choi | 2015-08-04 |
| 9059072 | Semiconductor packages and methods of fabricating the same | Eun-Kyoung Choi, SeYoung Jeong, Kwang-chul Choi, Chungsun Lee, Jung-Hwan Kim | 2015-06-16 |
| 8890325 | Heterojunction structures of different substrates joined and methods of fabricating the same | Un-Byoung Kang, Kwang-chul Choi, Jung-Hwan Kim | 2014-11-18 |
| 8884416 | Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip | Go-Eun Lee, Taeje Cho, Un-Byoung Kang, Seongmin Ryu, Jung-Hwan Kim | 2014-11-11 |
| 8884421 | Multi-chip package and method of manufacturing the same | Un-Byoung Kang, Jong-Joo Lee, Yong Hoon Kim | 2014-11-11 |
| 8854489 | Image processing method and image processing apparatus | Soon-geun Jang, Rae-hong Park, Hwan-soon Sung | 2014-10-07 |