Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859222 | Fan-out semiconductor package | Jung Soo Kim, Dae Jung Byun | 2018-01-02 |
| 9786573 | Electronic component package | Jong Rip Kim, Jong Myeon Lee | 2017-10-10 |
| 9788433 | Circuit board and method of manufacturing the same | Yul Kyo Chung, Yee Na Shin, Seung Eun Lee | 2017-10-10 |
| 9552508 | Fingerprint sensor module, portable electronic device including same, and method for manufacturing same | Jong Uk Kim, Hyun Kyu Tan, Sung Ki Lim, Seok Lee, Jae Hak Lee +2 more | 2017-01-24 |
| 9543076 | Electronic component and method of manufacturing the same | Moon Il Kim, Byoung Hwa Lee | 2017-01-10 |
| 9532397 | Method for providing communication service and electronic device thereof | Tae Young Oh, Il-Pyo Hong, Seong-Won Son, Tae-Sin Song | 2016-12-27 |
| 9526177 | Printed circuit board including electronic component embedded therein and method for manufacturing the same | Seung Eun Lee, Yul Kyo Chung, Yee Na Shin | 2016-12-20 |
| 9516740 | Electronic component embedded substrate and method for manufacturing electronic component embedded substrate | Tae Kyun Bae, Ho Shik Kang | 2016-12-06 |
| 9474167 | Multilayered substrate | Yee Na Shin, Seung Eun Lee, Yul Kyo Chung | 2016-10-18 |
| 9462697 | Electronic component embedded substrate and manufacturing method thereof | Yul Kyo Chung, Seung Eun Lee, Yee Na Shin | 2016-10-04 |
| 9443126 | Fingerprint sensor module, portable electronic device including same, and method for manufacturing same | Jong Uk Kim, Hyun Kyu Tan, Sung Ki Lim, Seok Lee, Jae Hak Lee +2 more | 2016-09-13 |
| 9420683 | Substrate embedding passive element | Yul Kyo Chung, Yee Na Shin, Seung Eun Lee | 2016-08-16 |
| 9313893 | Substrate having electronic component embedded therein and method of manufacturing the same | Yul Kyo Chung, Dae-Hyun Park, Yee Na Shin, Seung Eun Lee | 2016-04-12 |
| 9307632 | Multilayered substrate and method of manufacturing the same | Ho Shik Kang, Yee Na Shin, Yul Kyo Chung, Seung Eun Lee | 2016-04-05 |
| 9087837 | Semiconductor package and method of manufacturing the same | Tae Sung Jeong, Yul Kyo Chung | 2015-07-21 |
| 8929091 | Method of manufacturing a printed circuit board (PCB) | Kyung-Jin Han, Hyung Tae Kim, Moon Il Kim, Jae-Kul Lee | 2015-01-06 |
| 8889078 | Porous oxide catalyst and method of preparing the porous oxide catalyst | Sang Min Ji, Hyun Chul Lee, Seon-ah Jin | 2014-11-18 |
| 8881382 | Embedded printed circuit board and method of manufacturing the same | Sang Chul Lee, Jung Soo Byun, Jin Seon Park | 2014-11-11 |
| 8871569 | Semiconductor package and method of manufacturing the same | Tae Sung Jeong, Yul Kyo Chung | 2014-10-28 |
| 8780572 | Printed circuit board having electronic component | Tae Sung Jeong | 2014-07-15 |
| 8731608 | Communication method and apparatus of dual standby mode terminal | Ho Jin Jung, Seon-Jun Kim, Young Hak PARK | 2014-05-20 |
| 8692391 | Embedded ball grid array substrate and manufacturing method thereof | Tae Sung Jeong, Seung Eun Lee | 2014-04-08 |
| 8633397 | Method of processing cavity of core substrate | Jin Soo Jeong, Hwa-Sun Park, Jae-Kul Lee, Yul Kyo Chung | 2014-01-21 |
| 8633131 | Mesoporous oxide-catalyst complex and method of preparing the mesoporous oxide-catalyst complex | Hyun Chul Lee, Sang Min Ji, Kyo-sung Park, Seung Jae Lee, Seon-ah Jin | 2014-01-21 |
| 8633132 | Hydrocarbon reforming catalyst, method of preparing the same and fuel cell including the hydrocarbon reforming catalyst | Hyun Chul Lee, Eun-duck Park, Kang Hee Lee, Yun Ha Kim, Jae Hyun Park | 2014-01-21 |