Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10887995 | Method for manufacturing a printed circuit board including an embedded electronic component | Seung Eun Lee, Yee Na Shin, Doo Hwan Lee | 2021-01-05 |
| 10270948 | Substrate for camera module and camera module having the same | Seung Eun Lee, Jin Seon Park, Chul CHOI, Dae Young Jung, Seung Yeop Kook | 2019-04-23 |
| 10199329 | Fan-out semiconductor package | Moon Hee Yi, Joo Hwan Jung | 2019-02-05 |
| 10015884 | Printed circuit board including embedded electronic component and method for manufacturing the same | Seung Eun Lee, Yee Na Shin, Doo Hwan Lee | 2018-07-03 |
| 9875970 | Fan-out semiconductor package | Moon Hee Yi, Joo Hwan Jung | 2018-01-23 |
| 9788409 | Circuit board and method of manufacturing the same | Young Kwan Lee, Seung Eun Lee, Ki Jung SUNG | 2017-10-10 |
| 9788433 | Circuit board and method of manufacturing the same | Doo Hwan Lee, Yee Na Shin, Seung Eun Lee | 2017-10-10 |
| 9526177 | Printed circuit board including electronic component embedded therein and method for manufacturing the same | Seung Eun Lee, Yee Na Shin, Doo Hwan Lee | 2016-12-20 |
| 9474167 | Multilayered substrate | Yee Na Shin, Seung Eun Lee, Doo Hwan Lee | 2016-10-18 |
| 9462697 | Electronic component embedded substrate and manufacturing method thereof | Doo Hwan Lee, Seung Eun Lee, Yee Na Shin | 2016-10-04 |
| 9420683 | Substrate embedding passive element | Doo Hwan Lee, Yee Na Shin, Seung Eun Lee | 2016-08-16 |
| 9345141 | Multilayer ceramic capacitor and printed circuit board including the same | Seung Eun Lee, Byoung Hwa Lee, Yee Na Shin | 2016-05-17 |
| 9313893 | Substrate having electronic component embedded therein and method of manufacturing the same | Doo Hwan Lee, Dae-Hyun Park, Yee Na Shin, Seung Eun Lee | 2016-04-12 |
| 9307632 | Multilayered substrate and method of manufacturing the same | Doo Hwan Lee, Ho Shik Kang, Yee Na Shin, Seung Eun Lee | 2016-04-05 |
| 9155199 | Passive device embedded in substrate and substrate with passive device embedded therein | Yee Na Shin, Seung Eun Lee | 2015-10-06 |
| 9087837 | Semiconductor package and method of manufacturing the same | Doo Hwan Lee, Tae Sung Jeong | 2015-07-21 |
| 8871569 | Semiconductor package and method of manufacturing the same | Doo Hwan Lee, Tae Sung Jeong | 2014-10-28 |
| 8802999 | Embedded printed circuit board and manufacturing method thereof | Jong In Ryu, Tae Sung Jeong | 2014-08-12 |
| 8633397 | Method of processing cavity of core substrate | Jin Soo Jeong, Doo Hwan Lee, Hwa-Sun Park, Jae-Kul Lee | 2014-01-21 |
| 8618421 | Electronics component embedded PCB | Jung Soo Byun, Hwa-Sun Park, Kyung Min Lee, Mike Kim, Doo Hwan Lee | 2013-12-31 |
| 8547132 | Circuit board and method for testing component built in the circuit board | Hyun-Ho Kim, Won Geun Jung | 2013-10-01 |
| 8482890 | PCB strip and manufacturing method for electronic component embedded PCB | Moon Il Kim, Hwa-Sun Park | 2013-07-09 |
| 8482310 | Test method for passive device embedded printed circuit board | Hyun-Ho Kim, Won Geun Jung | 2013-07-09 |
| 8199456 | Capacitor and manufacturing method thereof | Sung Taek Lim, Woon Chun Kim | 2012-06-12 |
| 8064215 | Semiconductor chip package and printed circuit board | Sung Yi, Soon Gyu Yim, Seog Moon Choi, Jin Gu Kim, Young Do Kweon | 2011-11-22 |