Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699643 | Fan-out semiconductor package | Ik Jun Choi, Jae Ean LEE, Kwang Ok Jeong, Young Gwan Ko | 2023-07-11 |
| 11189552 | Semiconductor package | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Suk Ho Lee | 2021-11-30 |
| 10916495 | Fan-out semiconductor package | Ik Jun Choi, Jae Ean LEE, Kwang Ok Jeong, Young Gwan Ko | 2021-02-09 |
| 10796997 | Semiconductor package | Jae Ean LEE, Han Na Jin, Tae Sung Jeong, Young Gwan Ko | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Ik Jun Choi | 2020-09-29 |
| 10665535 | Semiconductor package | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Suk Ho Lee | 2020-05-26 |
| 10446478 | Semiconductor package | Kwang Ok Jeong, Dong Won Kang, Young Gwan Ko, Ik Jun Choi | 2019-10-15 |
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Ik Jun Choi | 2019-10-08 |
| 9392698 | Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB | Suk Chang Hong, Sang Kab Park, Kwang Seop Youm | 2016-07-12 |
| 8942004 | Printed circuit board having electronic components embedded therein | Suk Chang Hong, Bong Kyu Choi, Je-Gwang Yoo, Sang Wuk Jun, Sang Kab Park | 2015-01-27 |
| 8881382 | Embedded printed circuit board and method of manufacturing the same | Sang Chul Lee, Jin Seon Park, Doo Hwan Lee | 2014-11-11 |
| 8645183 | System for assessing an environmental load of building during life cycle | Sung Woo Shin, Han Seung Lee, Sung Ho Tae, Dae Won Kim, Young-Jun Park +3 more | 2014-02-04 |
| 8618421 | Electronics component embedded PCB | Yul Kyo Chung, Hwa-Sun Park, Kyung Min Lee, Mike Kim, Doo Hwan Lee | 2013-12-31 |
| 8339796 | Embedded printed circuit board and method of manufacturing the same | Sang Chul Lee, Jin Seon Park, Doo Hwan Lee | 2012-12-25 |