Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9356005 | Package of light emitting diode with heat sink | Su Jeong Suh, Jung-Kab Park, Tae-Yoo Kim, Young-lae CHO, Mi-Ri Lee +3 more | 2016-05-31 |
| 9136455 | Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof | Su Jeong Suh, Hyeong Chul Youn | 2015-09-15 |
| 9000593 | Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof | Su Jeong Suh, Hyeong Chul Youn | 2015-04-07 |
| 8633397 | Method of processing cavity of core substrate | Jin Soo Jeong, Doo Hwan Lee, Jae-Kul Lee, Yul Kyo Chung | 2014-01-21 |
| 8618421 | Electronics component embedded PCB | Jung Soo Byun, Yul Kyo Chung, Kyung Min Lee, Mike Kim, Doo Hwan Lee | 2013-12-31 |
| 8482890 | PCB strip and manufacturing method for electronic component embedded PCB | Moon Il Kim, Yul Kyo Chung | 2013-07-09 |
| 8302270 | Method of manufacturing capacitor-embedded PCB | Woon Chun Kim, Sung Yi, Hong Won Kim, Dae Jun Kim, Jin Seon Park | 2012-11-06 |
| 8166653 | Method of manufacturing printed circuit board having embedded resistors | Tae Eui Kim | 2012-05-01 |
| 7886414 | Method of manufacturing capacitor-embedded PCB | Woon Chun Kim, Sung Yi, Hong Won Kim, Dae Jun Kim, Jin Seon Park | 2011-02-15 |
| 7730612 | Method of manufacturing component-embedded printed circuit board | Sung Yi, Sang Chul Lee, Jong Woon Kim, Yul Kyo Chung | 2010-06-08 |
| 7328504 | Method for manufacturing circuit board with built-in electronic components | Seung-Gu Kim, Chang-Sup Ryu, Han-Seo Cho, Doo Hwan Lee | 2008-02-12 |
| 7037739 | Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency | Young Tae Byun, Seok Lee, Deok Ha Woo, Jong Chang Yi | 2006-05-02 |