Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153641 | Wafer level package having cylindrical capacitor and method of fabricating the same | Seung Seoup Lee | 2015-10-06 |
| 8866288 | Semiconductor package | Jong-Man Kim, Young Hoon Kwak, Chang Seob Hong | 2014-10-21 |
| 8786064 | Semiconductor package and method for manufacturing the same and semiconductor package module having the same | Jin Su Kim, Ji Man Ryu | 2014-07-22 |
| 8656582 | Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer | Seung Seoup Lee, Jong Woo Han | 2014-02-25 |
| 8471581 | Apparatus and method for inspecting defects in circuit pattern of substrate | Seung Seoup Lee, In Kyung Park | 2013-06-25 |
| 8409981 | Semiconductor package with a metal post and manufacturing method thereof | Woon Chun Kim, Young Do Kweon, Jae Kwang Lee | 2013-04-02 |
| 8378452 | Wafer level package having cylindrical capacitor and method of fabricating the same | Seung Seoup Lee | 2013-02-19 |
| 8366008 | Radio frequency identification tag, and method of manufacturing the same | Woon Chun Kim, Hyun-Seop Shim, Woon Bong Joh, Jae Suk Sung | 2013-02-05 |
| 8266792 | Method of manufacturing a printed circuit board with an embedded electronic component | Woon Chun Kim | 2012-09-18 |
| 8159071 | Semiconductor package with a metal post | Woon Chun Kim, Young Do Kweon, Jae Kwang Lee | 2012-04-17 |
| 8130508 | Electronic component embedded printed circuit board and manufacturing method thereof | Woon Chun Kim | 2012-03-06 |
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Sung Yi, Seog Moon Choi, Jin Gu Kim, Young Do Kweon | 2011-11-22 |