Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502464 | Method of manufacturing optical image stabilizer | — | 2016-11-22 |
| 9331070 | Variable capacitor and integrated circuit including the same | — | 2016-05-03 |
| 9153641 | Wafer level package having cylindrical capacitor and method of fabricating the same | Soon Gyu Yim | 2015-10-06 |
| 9128350 | Micro-iris unit and camera module including the same | — | 2015-09-08 |
| 9060734 | Fixed focus transducer array and ultrasonic wave transceiving apparatus using the same | — | 2015-06-23 |
| 8921146 | Method for manufacturing optical image stabilizer employing scratch drive actuator | — | 2014-12-30 |
| 8736139 | Optical image stabilizer and method of manufacturing the same | — | 2014-05-27 |
| 8666126 | Fingerprint detection sensor and method of detecting fingerprint | Il Kwon Chung, Jae Hyouck Choi, Jun Kyung Na | 2014-03-04 |
| 8656582 | Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer | Soon Gyu Yim, Jong Woo Han | 2014-02-25 |
| 8624618 | Apparatus and method for inspecting circuit of substrate | — | 2014-01-07 |
| 8614391 | Device for converting energy and method for manufacturing the device, and electronic apparatus with the device | — | 2013-12-24 |
| 8593532 | Optical image stabilizer employing a scratch drive actuator | — | 2013-11-26 |
| 8471581 | Apparatus and method for inspecting defects in circuit pattern of substrate | Soon Gyu Yim, In Kyung Park | 2013-06-25 |
| 8410465 | Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor | Jae-Cheon Doh, In Kyung Park | 2013-04-02 |
| 8378452 | Wafer level package having cylindrical capacitor and method of fabricating the same | Soon Gyu Yim | 2013-02-19 |
| 8283251 | Method of manufacturing wafer level package | Sung Yi | 2012-10-09 |
| 8111389 | Method of inspecting defects in circuit pattern of substrate | Tak Gyum Kim, Jin Won Park | 2012-02-07 |
| 7982982 | Wafer level packaging image sensor module having lens actuator and method of manufacturing the same | Sung Yi | 2011-07-19 |