Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049117 | Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby | Jung Won Lee, In Hyung Lee | 2011-11-01 |
| 8039759 | Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby | Jung Won Lee, In Hyung Lee | 2011-10-18 |
| 7943858 | Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor | Seung Eun Lee, Jung Won Lee, In Hyung Lee, Byung Ik Song | 2011-05-17 |
| 7927517 | Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same | Jun Hee Bae, Seung Hyun Kim, Won Hoon Song, Sung Taek Lim, Hyun-Ju Jin | 2011-04-19 |
| 7887879 | Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same | Jun Hee Bae, Seung Hyun Kim, Won Hoon Song, Sung Taek Lim, Hyun-Ju Jin | 2011-02-15 |
| 7886436 | Thin film capacitor-embedded printed circuit board and method of manufacturing the same | Jin Seok Moon, Soo Hyun Lyoo, Seung Hyun Sohn | 2011-02-15 |
| 7845073 | Method of manufacturing circuit board embedding thin film capacitor | In Hyung Lee, Bae Kyun Kim, Seung Eun Lee, Jung Won Lee | 2010-12-07 |
| 7812465 | Semiconductor chip having alignment mark and method of manufacturing the same | Jae-Kul Lee | 2010-10-12 |
| 7736397 | Method for manufacturing capacitor embedded in PCB | Seung Eun Lee, Hyung Dong Kang, Hyun-Ju Jin | 2010-06-15 |
| 7737529 | Printed circuit board with film capacitor embedded therein and method for manufacturing the same | Jin Seok Moon, Seung Eun Lee, Hyung Mi Jung, Seung Hyun Sohn | 2010-06-15 |
| 7730612 | Method of manufacturing component-embedded printed circuit board | Hwa-Sun Park, Sung Yi, Sang Chul Lee, Jong Woon Kim | 2010-06-08 |
| 7675756 | Thin film-capacitor-embedded printed circuit board and method of manufacturing the same | Jin Seok Moon, Soo Hyun Lyoo, Seung Hyun Sohn | 2010-03-09 |
| 7609504 | High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same | Eun Tae Park, Jeong Joo Kim, Hee Young Lee, Eun-Sub Lim, Jong Chul Lee | 2009-10-27 |
| 7540913 | Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same | Jun Hee Bae, Seung Hyun Kim, Won Hoon Song, Sung Taek Lim, Hyun-Ju Jin | 2009-06-02 |
| 7485411 | Method for manufacturing printed circuit board with thin film capacitor embedded therein | Hyung Mi Jung, Hyung Dong Kang | 2009-02-03 |
| 7417870 | Multi-layer board with decoupling function | Sung Taek Lim | 2008-08-26 |
| 7293356 | Method of fabricating printed circuit board having embedded multi-layer passive devices | Seung Hyun Sohn, Hyun-Ju Jin, Eun Tae Park | 2007-11-13 |