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Acoustic resonator and method of manufacturing the same |
Ran Hee SHIN, Tae Kyung LEE, Sung-Wook Han, Yun Sung Kang, Sung Sun Kim +3 more |
2024-02-20 |
| 11637539 |
Surface acoustic wave device package and method of manufacturing the same |
Jun Woo Yong, Jung-Hoon Han, Bong-Soo Kim |
2023-04-25 |
| 10541668 |
Acoustic resonator and method of manufacturing the same |
Ran Hee SHIN, Tae Kyung LEE, Sung-Wook Han, Yun Sung Kang, Sung Sun Kim +3 more |
2020-01-21 |
| 10446506 |
Wafer level package and manufacturing method thereof |
Jung-Hoon Han, Jin-Ho Ha, Jun Woo Yong |
2019-10-15 |
| 8753462 |
Method of manufacturing non-shrinking multilayer ceramic substrate |
Beom Joon Cho, Hyoung Ho Kim |
2014-06-17 |
| 8492954 |
Ultrasonic sensor |
Boum Seock Kim |
2013-07-23 |
| 8446663 |
Electronic paper display device and method for manufacturing the same |
Boum Seock Kim, Seung Gyo Jeong |
2013-05-21 |
| 8421609 |
Haptic feedback device and electronic device having the same |
Boum Seock Kim, Seung Gyo Jeong |
2013-04-16 |
| 8093172 |
Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same |
Ho Sung Choo, Jong Myeon Lee, Myung Whun Chang, Soo Hyun Lyoo, Beom Joon Cho |
2012-01-10 |
| 7871482 |
Method of manufacturing multilayer ceramic substrate |
Yong-Seok Choi, Seung Gyo Jeong, Ki Pyo Hong, Soo Hyun Lyoo |
2011-01-18 |
| 7609504 |
High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same |
Jeong Joo Kim, Hee Young Lee, Eun-Sub Lim, Jong Chul Lee, Yul Kyo Chung |
2009-10-27 |
| 7567426 |
Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein |
Min Ji Ko |
2009-07-28 |
| 7293356 |
Method of fabricating printed circuit board having embedded multi-layer passive devices |
Seung Hyun Sohn, Yul Kyo Chung, Hyun-Ju Jin |
2007-11-13 |
