Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293996 | Semiconductor package including heat dissipation structure | Seung Eun Lee, Yong Hoon Kim | 2025-05-06 |
| 11831089 | Antenna substrate and antenna module comprising the same | Tae-Seong Kim | 2023-11-28 |
| 10332843 | Fan-out semiconductor package | Yong Ho Baek, Kyung Sang LIM | 2019-06-25 |
| 10283439 | Fan-out semiconductor package including electromagnetic interference shielding layer | Jung-Hyun Cho, Yong Ho Baek, Jun Oh Hwang, Joo Hwan Jung | 2019-05-07 |
| 10256192 | Fan-out semiconductor package | Byoung Chan Kim, Yong Ho Baek, Jung-Hyun Cho | 2019-04-09 |
| 10199329 | Fan-out semiconductor package | Joo Hwan Jung, Yul Kyo Chung | 2019-02-05 |
| 10177103 | Fan-out semiconductor package | Yong Ho Baek, Tae-Seong Kim | 2019-01-08 |
| 10026678 | Fan-out semiconductor package | Jung-Hyun Cho, Yong Ho Baek, Jun Oh Hwang, Joo Hwan Jung | 2018-07-17 |
| 9875970 | Fan-out semiconductor package | Joo Hwan Jung, Yul Kyo Chung | 2018-01-23 |