Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643891 | Via structures and via patterning using oblique angle deposition processes | Qanit Takmeel, Somnath Ghosh, Craig Child, Sunil Kumar Singh | 2020-05-05 |
| 10181420 | Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias | Jason E. Stephens, David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski +6 more | 2019-01-15 |