| 11043418 |
Middle of the line self-aligned direct pattern contacts |
Daniel Chanemougame, Ruilong Xie, Lars Liebmann, Gregory A. Northrop |
2021-06-22 |
|
| 10741439 |
Merge mandrel features |
Hsueh-Chung Chen, Martin O'Toole, Terry A. Spooner |
2020-08-11 |
$73,029,000 |
| 10559503 |
Methods, apparatus and system for a passthrough-based architecture |
Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye +3 more |
2020-02-11 |
$41,457,000 |
| 10522403 |
Middle of the line self-aligned direct pattern contacts |
Daniel Chanemougame, Ruilong Xie, Lars Liebmann, Gregory A. Northrop |
2019-12-31 |
$50,351,000 |
| 10340180 |
Merge mandrel features |
Hsueh-Chung Chen, Martin O'Toole, Terry A. Spooner |
2019-07-02 |
$29,708,000 |
| 10262941 |
Devices and methods for forming cross coupled contacts |
Guillaume Bouche, Tuhin Guha Neogi, Kai Sun, Deniz E. Civay, David Pritchard +1 more |
2019-04-16 |
$37,439,000 |
| 10236350 |
Method, apparatus and system for a high density middle of line flow |
Guillaume Bouche, Tuhin Guha Neogi, Sudharshanan Raghunathan, Andy Chi-Hung Wei, Vikrant Chauhan +1 more |
2019-03-19 |
$18,879,000 |
| 10181420 |
Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias |
David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski, Anbu Selvam K M Mahalingam +6 more |
2019-01-15 |
$34,514,000 |
| 10056373 |
Transistor contacts self-aligned in two dimensions |
Andy Wei, Guillaume Bouche, Mark A. Zaleski, Tuhin Guha Neogi, Jongwook Kye +1 more |
2018-08-21 |
$9,392,000 |
| 9852986 |
Method of patterning pillars to form variable continuity cuts in interconnection lines of an integrated circuit |
Guillaume Bouche |
2017-12-26 |
$7,266,000 |
| 9825031 |
Methods of forming a high-k contact liner to improve effective via separation distance and the resulting devices |
Guillaume Bouche, Andy Wei, David Permana, Jagannathan Vasudevan |
2017-11-21 |
$10,021,000 |
| 9818651 |
Methods, apparatus and system for a passthrough-based architecture |
Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye +3 more |
2017-11-14 |
$7,693,000 |
| 9818623 |
Method of forming a pattern for interconnection lines and associated continuity blocks in an integrated circuit |
Guillaume Bouche, Byoung Youp Kim, Craig Child |
2017-11-14 |
$7,693,000 |
| 9818640 |
Apparatus and method of forming self-aligned cuts in a non-mandrel line of an array of metal lines |
Guillaume Bouche |
2017-11-14 |
$7,693,000 |
| 9818641 |
Apparatus and method of forming self-aligned cuts in mandrel and a non-mandrel lines of an array of metal lines |
Guillaume Bouche |
2017-11-14 |
$7,693,000 |
| 9812396 |
Interconnect structure for semiconductor devices with multiple power rails and redundancy |
Guillaume Bouche, Shreesh Narasimha, Patrick R. Justison, Byoung Youp Kim, Craig Child |
2017-11-07 |
$8,746,000 |
| 9786545 |
Method of forming ANA regions in an integrated circuit |
Guillaume Bouche, Byoung Youp Kim, Craig Child, Shreesh Narasimha |
2017-10-10 |
$14,921,000 |
| 9779943 |
Compensating for lithographic limitations in fabricating semiconductor interconnect structures |
Guillaume Bouche |
2017-10-03 |
$10,070,000 |
| 9691626 |
Method of forming a pattern for interconnection lines in an integrated circuit wherein the pattern includes gamma and beta block mask portions |
Guillaume Bouche |
2017-06-27 |
$11,625,000 |
| 9660040 |
Transistor contacts self-aligned two dimensions |
Andy Wei, Guillaume Bouche, Mark A. Zaleski, Tuhin Guha Neogi, Jongwook Kye +1 more |
2017-05-23 |
$8,404,000 |
| 9576735 |
Vertical capacitors with spaced conductive lines |
Roderick A. Augur |
2017-02-21 |
$8,671,000 |
| 9530689 |
Methods for fabricating integrated circuits using multi-patterning processes |
Deniz E. Civay, Jiong Li, Guillaume Bouche, Richard A. Farrell |
2016-12-27 |
$8,113,000 |
| 9502528 |
Borderless contact formation through metal-recess dual cap integration |
Guillaume Bouche, Tuhin Guha Neogi, Mark A. Zaleski, Andy Wei |
2016-11-22 |
$8,427,000 |
| 9472455 |
Methods of cross-coupling line segments on a wafer |
Lei Yuan, Lixia Lei, David Pritchard, Tuhin Guha Neogi |
2016-10-18 |
$3,531,000 |
| 9465907 |
Multi-polygon constraint decomposition techniques for use in double patterning applications |
Ahmed Hassan, Nader Magdy Hindawy, Vikrant Chauhan, David Pritchard, Abbas Guvenilir +2 more |
2016-10-11 |
$4,519,000 |
