Issued Patents All Time
Showing 26–50 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694975 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2023-07-04 |
| 11659214 | Automated workflows from media asset differentials | Yadong Wang, Kyle Tacke, Shilpa Jois Rao, Boney Sekh, Andrew Swan +1 more | 2023-05-23 |
| 11636872 | Techniques for computing perceived audio quality based on a trained multitask learning model | Phillip A. Williams, William Francis Wolcott, IV | 2023-04-25 |
| 11600595 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2023-03-07 |
| 11557568 | Package and manufacturing method thereof | Szu-Wei Lu, Ying-Ching Shih | 2023-01-17 |
| 11515403 | Semiconductor device and method | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Ying-Tsung Chen, Ying-Ho Chen | 2022-11-29 |
| 11515267 | Dummy die placement without backside chipping | Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2022-11-15 |
| 11488882 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2022-11-01 |
| 11482508 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2022-10-25 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu +2 more | 2022-10-25 |
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu | 2022-09-27 |
| 11424194 | Three dimensional integrated circuit (3DIC) with support structures | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2022-08-23 |
| 11424173 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2022-08-23 |
| 11410897 | Semiconductor structure having a dielectric layer edge covering circuit carrier | Szu-Wei Lu, Ying-Ching Shih | 2022-08-09 |
| 11381247 | Method of detecting jitter in clock of apparatus and apparatus utilizing same | Wen-Hong Hsu, Po-Hua Chen, Yu-Yee Liow, Hsuan Chih Yeh | 2022-07-05 |
| 11352725 | Wire tension control device and braiding machine using the same | Yi-Ping Huang, Yi Li | 2022-06-07 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu | 2022-04-05 |
| 11289424 | Package and method of manufacturing the same | Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2022-03-29 |
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2022-03-08 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2022-02-22 |
| 11205615 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2021-12-21 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11183482 | Shift control method in manufacture of semiconductor device | Ying-Ching Shih, Hsien-Ju Tsou | 2021-11-23 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Kuo-Chiang Ting, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |