Issued Patents All Time
Showing 76–100 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2019-07-02 |
| 10319780 | Light-emitting element having a plurality of light-emitting structures | Chen Ou, Chun-Wei Chang, Sheng-Chih WANG, Hsin-Mei Tsai, Chia-Chen Tsai +1 more | 2019-06-11 |
| 10290773 | Light-emitting device | Chen Ou, Liang-Sheng Chi, Chun-Wei Chang | 2019-05-14 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Szu-Wei Lu, Jing-Cheng Lin | 2019-04-23 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |
| 10253232 | Method of lubricating a rotary screw compressor | Hsinheng Li, Jeng-Shiang Tsaih, Hsu-Hua Tang, Jung-Tsung Hung, Tai-Her Tsai +1 more | 2019-04-09 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-01-01 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10115650 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2018-10-30 |
| 10008218 | Blind bandwidth extension using K-means and a support vector machine | Mark S. Vinton | 2018-06-26 |
| 9987734 | Flat clinch anvil assembly | Joel S. Marks | 2018-06-05 |
| 9929109 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2018-03-27 |
| 9768227 | Light-emitting element having a plurality of light-emitting structures | Chen Ou, Chun-Wei Chang, Sheng-Chih WANG, Hsin-Mei Tsai, Chia-Chen Tsai +1 more | 2017-09-19 |
| 9704825 | Chip packages and methods of manufacture thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2017-07-11 |
| 9570421 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2017-02-14 |
| 9530646 | Method of forming a semiconductor structure | Li-Wei Feng, Shih-Hung Tsai, Chao-Hung Lin, Hon-Huei Liu, An-Chi Liu +8 more | 2016-12-27 |
| 9449567 | Common voltage compensation in display apparatus | Ying-Ji Chen, Kun-Lang Wu, Teng-Liang Yu, Wen-Chieh Huang | 2016-09-20 |
| 9368458 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2016-06-14 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2016-05-10 |
| 9293369 | Three-dimensional integrated circuit (3DIC) | Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2016-03-22 |
| 8946893 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Szu-Wei Lu, Jing-Cheng Lin | 2015-02-03 |
| 8749077 | Three-dimensional integrated circuit (3DIC) | Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2014-06-10 |
| 8580683 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2013-11-12 |
| 8569086 | Semiconductor device and method of dicing semiconductor devices | Jing-Cheng Lin, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2013-10-29 |