Issued Patents All Time
Showing 51–75 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152330 | Semiconductor package structure and method for forming the same | Cheng-Chieh Li, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2021-10-19 |
| 11145562 | Package structure and method of manufacturing the same | Jung-Hua Chang, Szu-Wei Lu, Ying-Ching Shih | 2021-10-12 |
| 11139285 | Semiconductor package | Hsien-Ju Tsou, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2021-10-05 |
| 11133286 | Chip packages and methods of manufacture thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11088086 | Chip package structure and method for forming the same | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2021-08-10 |
| 10930701 | Light-emitting element having a plurality of light-emitting structures | Chen Ou, Chun-Wei Chang, Sheng-Chih WANG, Hsin-Mei Tsai, Chia-Chen Tsai +1 more | 2021-02-23 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2021-02-09 |
| 10872862 | Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same | Ying-Ching Shih | 2020-12-22 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Szu-Wei Lu, Ying-Ching Shih | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10861799 | Dummy die placement without backside chipping | Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2020-10-13 |
| 10756058 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2020-08-25 |
| 10741467 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2020-08-11 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2020-03-10 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |
| D872040 | Super thin two-screen display | — | 2020-01-07 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2020-01-07 |
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-17 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-03 |
| 10490474 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2019-11-26 |
| 10483234 | Chip packages and methods of manufacture thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2019-11-19 |