Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421600 | 2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber | Ta-Hao Kuo, CHING-LIANG YI | 2025-09-23 |
| 12409612 | Bonding method and apparatus of substrates | Pei-Yun Chiang | 2025-09-09 |
| 12403685 | Plate cooling device and de-bonding station with plate cooling device | Ta-Hao Kuo | 2025-09-02 |
| 12381114 | Package structure with fan-out feature | Ling Li, Cheng-Lin Huang | 2025-08-05 |
| 12368123 | Package structure including stacked pillar portions and method for fabricating the same | Szu-Wei Lu, Ying-Ching Shih | 2025-07-22 |
| 12272663 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2025-04-08 |
| 12264817 | Manufacturing method of optical device, optical device with quantum dots, and illumination apparatus with quantum dots | CHING-LIANG YI, Chen-Yang Huang | 2025-04-01 |
| 12255173 | Chip package structure | Ling Li, Cheng-Lin Huang | 2025-03-18 |
| 12125721 | Parallelism-adjustable bonding machine | Jing-Cheng Lin, Mao-Chan Chang | 2024-10-22 |
| 12040215 | Bonding machine with movable suction modules | Jing-Cheng Lin | 2024-07-16 |
| 12031208 | Atomic layer deposition apparatus for powders | Jing-Cheng Lin, Chia-Cheng Ku | 2024-07-09 |
| 12033968 | Package structure including stacked pillar portions | Szu-Wei Lu, Ying-Ching Shih | 2024-07-09 |
| 12006571 | Atomic layer deposition apparatus for coating on fine powders | Jing-Cheng Lin, CHING-LIANG YI, Chia-Cheng Ku | 2024-06-11 |
| 11987883 | Powder atomic layer deposition apparatus for blowing powders | Jing-Cheng Lin, Chia-Cheng Ku | 2024-05-21 |
| 11961753 | Substrate-bonding device | Jing-Cheng Lin, Mao-Chan Chang | 2024-04-16 |
| 11952662 | Powder atomic layer deposition equipment with quick release function | Jing-Cheng Lin, Chia-Cheng Ku | 2024-04-09 |
| 11948876 | Package structure with through vias | Ling Li, Cheng-Lin Huang | 2024-04-02 |
| 11855039 | Chip package structure | Ling Li, Cheng-Lin Huang | 2023-12-26 |
| 11784091 | Structure and formation method of chip package with fan-out feature | Ling Li, Cheng-Lin Huang | 2023-10-10 |
| 11773319 | Quantum dot particles with passivation layer and manufacturing method thereof | Jing-Cheng Lin | 2023-10-03 |
| 11767591 | Detachable atomic layer deposition apparatus for powders | Jing-Cheng Lin, Chia-Cheng Ku | 2023-09-26 |
| 11739423 | Atomic layer deposition apparatus for coating on fine powders | Jing-Cheng Lin, Ta-Hao Kuo, Chia-Cheng Ku | 2023-08-29 |
| 11735456 | Alignment mechanism and alignment method of bonding machine | Jing-Cheng Lin, Mao-Chan Chang | 2023-08-22 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Szu-Wei Lu, Ying-Ching Shih | 2023-06-20 |
| 11569159 | Structure and formation method of chip package with through vias | Ling Li, Cheng-Lin Huang | 2023-01-31 |