Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502040 | Package structure and semiconductor pacakge | Chin-Fu Kao | 2022-11-15 |
| 11476219 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2022-10-18 |
| 11456268 | Semiconductor package and manufacturing method thereof | Chin-Fu Kao | 2022-09-27 |
| 11456276 | Chip package structure | Ling Li, Cheng-Lin Huang | 2022-09-27 |
| 11355406 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2022-06-07 |
| 11322380 | Substrate transfer system with tray aligner | Jing-Cheng Lin | 2022-05-03 |
| 11145562 | Package structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2021-10-12 |
| 11139260 | Plurality of stacked pillar portions on a semiconductor structure | Szu-Wei Lu, Ying-Ching Shih | 2021-10-05 |
| 11114405 | Semiconductor package structure with twinned copper | Po-Hao Tsai, Jing-Cheng Lin | 2021-09-07 |
| 11004797 | Package structure, semiconductor package and method of fabricating the same | Chin-Fu Kao | 2021-05-11 |
| 10784222 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2020-09-22 |
| 10777531 | Package contact structure, semiconductor package and manufacturing method thereof | Chin-Fu Kao | 2020-09-15 |
| 10770427 | Chip package structure and method for forming the same | Ling Li, Cheng-Lin Huang | 2020-09-08 |
| 10699981 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2020-06-30 |
| 10522470 | Package structure and method of fabricating the same | Chin-Fu Kao | 2019-12-31 |
| 10515923 | Method for forming semiconductor package structure with twinned copper layer | Jing-Cheng Lin, Po-Hao Tsai | 2019-12-24 |
| 10134701 | Solder bump for ball grid array | Cheng-Lin Huang, Jing-Cheng Lin | 2018-11-20 |
| 10115647 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2018-10-30 |
| 9711472 | Solder bump for ball grid array | Cheng-Lin Huang, Jing-Cheng Lin | 2017-07-18 |
| 9379080 | Method and apparatus for a conductive pillar structure | Cheng-Lin Huang, Nai-Wei Liu, Jui-Pin Hung, Jing-Cheng Lin | 2016-06-28 |
| 9159687 | Solder bump for ball grid array | Cheng-Lin Huang, Jing-Cheng Lin | 2015-10-13 |
| 8994171 | Method and apparatus for a conductive pillar structure | Cheng-Lin Huang, Nai-Wei Liu, Jui-Pin Hung, Jing-Cheng Lin | 2015-03-31 |
| 8847389 | Method and apparatus for a conductive bump structure | Cheng-Lin Huang, Jing-Cheng Lin | 2014-09-30 |