WW

Wen-Hsin Wei

TSMC: 35 patents #964 of 12,232Top 8%
JN Juniper Networks: 3 patents #1,011 of 2,602Top 40%
Alcatel Lucent: 1 patents #1,993 of 4,169Top 50%
II Institute For Information Industry: 1 patents #327 of 904Top 40%
NO Nokia Solutions And Networks Oy: 1 patents #855 of 1,934Top 45%
Nokia Technologies Oy: 1 patents #1,600 of 3,242Top 50%
📍 Hsinchu, CA: #90 of 400 inventorsTop 25%
Overall (All Time): #72,092 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 26–42 of 42 patents

Patent #TitleCo-InventorsDate
10770365 Package structures and methods of forming the same Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more 2020-09-08
10535633 Chip package having die structures of different heights and method of forming same Hsien-Pin Hu, Shang-Yun Hou 2020-01-14
10529679 3D packages and methods for forming the same Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more 2020-01-07
10515906 Forming large chips through stitching Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen 2019-12-24
10319699 Chip package having die structures of different heights Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen 2019-06-11
10163853 Formation method of chip package Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen 2018-12-25
10163856 Stacked integrated circuit structure and method of forming Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou 2018-12-25
10153222 Package structures and methods of forming the same Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more 2018-12-11
9818720 Structure and formation method for chip package Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen 2017-11-14
9806058 Chip package having die structures of different heights and method of forming same Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen 2017-10-31
9741669 Forming large chips through stitching Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen 2017-08-22
9048231 3D packages and methods for forming the same Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more 2015-06-02
8802504 3D packages and methods for forming the same Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more 2014-08-12
8059604 System and method of measuring heterogeneous network mobile communication apparatus and recording medium thereof Chih-Wei Su 2011-11-15
8001524 Instruction extension for linked list lookup Dongping Luo, Lidong Zhao 2011-08-16
7930516 Linked list traversal with reduced memory accesses Xiangdong Jin, Dongping Luo 2011-04-19
7600094 Linked list traversal with reduced memory accesses Xiangdong Jin, Dongping Luo 2009-10-06