Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412805 | Semiconductor package | Chen-Hsiang Lao, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2025-09-09 |
| 12080623 | Integrated circuit packages having mechanical brace standoffs | Chih-Kai Cheng, Tsung-Shu Lin | 2024-09-03 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2024-05-28 |
| 11011451 | Integrated circuit package and method | Chih-Kai Cheng, Tsung-Shu Lin | 2021-05-18 |