Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2025-08-19 |
| 12237288 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang +1 more | 2025-02-25 |
| 11990443 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang +1 more | 2024-05-21 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2023-08-15 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11146056 | Interface control circuit and control method thereof | Chih-Wei Mu, Sheng-Tsung Chen, Chieh-Min Lo, Wei-Chung Chang | 2021-10-12 |
| 11121288 | Package structure of light-emitting element | Jung-Tang Chu, Kun-Yang Hsieh, Che-Hung Lin | 2021-09-14 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-12-29 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Chih Huang, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai | 2020-05-19 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2019-04-23 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-12-18 |
| 10125014 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen | 2018-11-13 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-27 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9850126 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen | 2017-12-26 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen +1 more | 2017-06-27 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9132523 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Shen-Nan Lee, Ying-Mei Lin, Keung Hui, Huan-Just Lin | 2015-09-15 |
| 8445296 | Apparatus and methods for end point determination in reactive ion etching | Chien Rhone Wang, Tzu-Cheng Lin, Chih-Wei Lai, Hung-Pin Chang, Tsang-Jiuh Wu | 2013-05-21 |
| 8239056 | Advanced process control for new tapeout product | Chih-Wei Hsu, Wen-Pin Liu, Shun-Ping Wang, Shin-Rung Lu, Jo Fei Wang +3 more | 2012-08-07 |
| 8129279 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Shen-Nan Lee, Ying-Mei Lin, Keung Hui, Huan-Just Lin | 2012-03-06 |
| 8079737 | Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency | Bily Wang, Ping-Chou Yang | 2011-12-20 |
| 6522235 | Switch structure for a heating device | — | 2003-02-18 |