Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096482 | Apparatus and method for chemical mechanical polishing process control | Jin-Ning Sung, Jong-I Mou, Soon-Kang Huang, Yen-Di Tsen | 2018-10-09 |
| 9323244 | Semiconductor fabrication component retuning | Cheng Yen-Wei, Jong-I Mou | 2016-04-26 |
| 9158301 | Semiconductor processing dispatch control | Sunny Wu, Yen-Di Tsen, Chun-Hsien Lin, Jo Fei Wang, Jong-I Mou | 2015-10-13 |
| 9132523 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Shen-Nan Lee, Ying-Mei Lin, Yu-Jen Cheng, Huan-Just Lin | 2015-09-15 |
| 9102033 | Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process | Jin-Ning Sung, Huang Soon Kang, Yen-Di Tsen, Jong-I Mou | 2015-08-11 |
| 8925479 | System and method of dosage profile control | Chun-Lin Chang, Jong-I Mou | 2015-01-06 |
| 8781614 | Semiconductor processing dispatch control | Sunny Wu, Yen-Di Tsen, Chun-Hsien Lin, Jo Fei Wang, Jong-I Mou | 2014-07-15 |
| 8309444 | System and method of dosage profile control | Chun-Lin Chang, Jong-I Mou | 2012-11-13 |
| 8294124 | Scanning method and system using 2-D ion implanter | Chun-Lin Chang | 2012-10-23 |
| 8295965 | Semiconductor processing dispatch control | Sunny Wu, Yen-Di Tsen, Chun-Hsien Lin, Jo Fei Wang, Jong-I Mou | 2012-10-23 |
| 8129279 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Shen-Nan Lee, Ying-Mei Lin, Yu-Jen Cheng, Huan-Just Lin | 2012-03-06 |