BW

Bily Wang

HA Harvatek: 85 patents #1 of 61Top 2%
YE Youngtek Electronics: 17 patents #1 of 26Top 4%
Overall (All Time): #13,779 of 4,157,543Top 1%
103
Patents All Time

Issued Patents All Time

Showing 25 most recent of 103 patents

Patent #TitleCo-InventorsDate
9029725 Packaged chip detection and classification device Kuei-Pao Chen, Hsin-Cheng Chen 2015-05-12
8873920 Light-guiding cover structure Kuei-Pao Chen, Hsin-Cheng Chen, Cheng-Chin Chiu 2014-10-28
8748209 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same HUNG-CHOU YANG, JENG-RU CHANG 2014-06-10
8710387 LED package chip classification system Kuei-Pao Chen, Hsin-Cheng Chen 2014-04-29
8686310 Packaged chip detection and classification device Kuei-Pao Chen, Hsin-Cheng Chen 2014-04-01
8623680 LED chip package structure using sedimentation and method for making the same Shih-Yu Wu, Chao Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang 2014-01-07
8556463 Simple detachable illumination structure and lamp tube Chi-Tseng Chang, Chi-Kang Lo, Zhen Hao Fan 2013-10-15
8555492 Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach SUNG-YI HSIAO, Jack Chen 2013-10-15
8525524 Multi-track detection system for detecting the appearance of electronic elements Kuei-Pao Chen, Hsin-Cheng Chen, Ren-Chun Ni 2013-09-03
8519458 Light-emitting element detection and classification device Kuei-Pao Chen, Hsin-Cheng Chen 2013-08-27
8421884 GPS device with a display function and method for using the same Yuan-Hsiu Yang 2013-04-16
8398275 Lamp head assembly and lighting lamp tube Chi-Tseng Chang, Chi-Kang Lo, Zhen Hao Fan 2013-03-19
8263876 Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same SUNG-YI HSIAO, Jack Chen 2012-09-11
8198800 LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same Shih-Yu Wu, Wen-Kuei Wu 2012-06-12
D660259 Strip LED Wen-Kuei Wu, Ping-Chou Yang 2012-05-22
8183065 LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same Shih-Yu Wu, Wen-Kuei Wu 2012-05-22
D659655 LED package base 2012-05-15
D659654 LED package base 2012-05-15
8162514 Illumination device with a fire-fighting function 2012-04-24
8162510 LED chip package structure with multifunctional integrated chips and a method for making the same Shih-Yu Wu, Wen-Kuei Wu 2012-04-24
8138508 LED chip package structure with different LED spacings and a method for making the same Shih-Yu Wu, Wen-Kuei Wu 2012-03-20
8137999 Package for a light emitting diode and method for fabricating the same Jonnie Chuang, Hui-Yen Huang 2012-03-20
8107720 Detection system for detecting appearances of many electronic elements and methods of using the same Kuei-Pao Chen, Hsin-Cheng Chen, Ming-Hao Chou, Ren-Chun Ni 2012-01-31
8079737 Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency Ping-Chou Yang, Yu-Jen Cheng 2011-12-20
8053885 Wafer level vertical diode package structure and method for making the same SUNG-YI HSIAO, Jack Chen 2011-11-08