SW

Shih-Yu Wu

HA Harvatek: 12 patents #4 of 61Top 7%
AS Academia Sinica: 1 patents #407 of 1,112Top 40%
Overall (All Time): #376,286 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
10971677 Electrically controlled nanomagnet and spin orbit torque magnetic random access memory including the same Hsin Fu Lin, Chuang-Han Hsu 2021-04-06
8623680 LED chip package structure using sedimentation and method for making the same Bily Wang, Chao Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang 2014-01-07
8198800 LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same Bily Wang, Wen-Kuei Wu 2012-06-12
8183065 LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same Bily Wang, Wen-Kuei Wu 2012-05-22
8162510 LED chip package structure with multifunctional integrated chips and a method for making the same Bily Wang, Wen-Kuei Wu 2012-04-24
8138508 LED chip package structure with different LED spacings and a method for making the same Bily Wang, Wen-Kuei Wu 2012-03-20
8017969 LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same Bily Wang, Wen-Kuei Wu 2011-09-13
8002436 LED chip package structure using a substrate as a lampshade and method for making the same Bily Wang, Wen-Kuei Wu 2011-08-23
7828464 LED lamp structure and system with high-efficiency heat-dissipating function Bily Wang, Jonnie Chuang 2010-11-09
7829901 LED chip package structure with high-efficiency light-emitting effect and method for making the same Bily Wang, Wen-Kuei Wu 2010-11-09
7815346 Method for calculating out an optimum arrangement pitch between each two LED chip package units Bily Wang, Wen-Kuei Wu 2010-10-19
7614766 Modular illumination device with adjustable lighting angles Bily Wang, Hui-Chung Lin 2009-11-10
7485480 Method of manufacturing high power light-emitting device package and structure thereof Bily Wang, Jonnie Chuang 2009-02-03