Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8137999 | Package for a light emitting diode and method for fabricating the same | Bily Wang, Hui-Yen Huang | 2012-03-20 |
| 8003413 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same | Bily Wang, Chia-Hung Chen | 2011-08-23 |
| 7951621 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Wen-Kuei Wu | 2011-05-31 |
| 7923745 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Wen-Kuei Wu | 2011-04-12 |
| 7842964 | Front and rear covering type LED package structure and method for packaging the same | Bily Wang, Hui-Yen Huang, Chao Yuan Huang | 2010-11-30 |
| 7834365 | LED chip package structure with high-efficiency light-emitting effect and method of packing the same | Bily Wang, Wen-Kuei Wu | 2010-11-16 |
| 7828464 | LED lamp structure and system with high-efficiency heat-dissipating function | Bily Wang, Shih-Yu Wu | 2010-11-09 |
| 7824938 | Method for manufacturing an LED chip package structure | Bily Wang, Hui-Yen Huang | 2010-11-02 |
| 7804162 | Multi-wavelength white light-emitting structure | Bily Wang, Chuan-Fa Lin | 2010-09-28 |
| 7803641 | Mold structure for packaging LED chips and method thereof | Bily Wang, Hui-Yen Huang | 2010-09-28 |
| 7749781 | Method for manufacturing a light-emitting diode having high heat-dissipating efficiency | Bily Wang, Miko Huang | 2010-07-06 |
| 7741648 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same | Bily Wang, Chia-Hung Chen | 2010-06-22 |
| 7737635 | High efficiency white light emitting diode and method for manufacturing the same | Bily Wang, Chao Yuan Huang | 2010-06-15 |
| 7701124 | White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend | Bily Wang, Chuanfa Lin, Chih-Shan Yu | 2010-04-20 |
| 7671373 | LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same | Bily Wang, Chia-Hung Chen | 2010-03-02 |
| 7671374 | LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same | Bily Wang, Hui-Yen Huang | 2010-03-02 |
| 7662661 | Method of manufacturing a substrate structure for increasing cutting precision and strength thereof | Bily Wang, Hui-Yen Huang | 2010-02-16 |
| 7655997 | Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same | Bily Wang, Chuan-Fa Lin, Chi-Wen Hung | 2010-02-02 |
| 7563641 | Laminated light-emitting diode display device and manufacturing method thereof | Bily Wang, Chuanfa Lin, Chao Yuan Huang | 2009-07-21 |
| 7515061 | LED package structure for increasing light-emitting efficiency and method of packaging the same | Bily Wang, Chi-Wen Hung | 2009-04-07 |
| 7485480 | Method of manufacturing high power light-emitting device package and structure thereof | Bily Wang, Shih-Yu Wu | 2009-02-03 |
| 7303984 | Semiconductor substrate structure and processing method thereof | Bily Wang, Hui-Yen Huang | 2007-12-04 |
| 7276782 | Package structure for semiconductor | Billy Wang, Chi-Wen Hung, Chuan-Fa Lin | 2007-10-02 |
| 7255463 | Lighting module | Bily Wang, Chun-Cheng Weng | 2007-08-14 |
| 7237938 | Backlight module | Bily Wang, Chuanfa Lin | 2007-07-03 |