Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8555492 | Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach | Bily Wang, Jack Chen | 2013-10-15 |
| 8263876 | Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same | Bily Wang, Jack Chen | 2012-09-11 |
| 8053885 | Wafer level vertical diode package structure and method for making the same | Bily Wang, Jack Chen | 2011-11-08 |
| D645421 | LED base | Bily Wang, Jack Chen | 2011-09-20 |
| 7923747 | Wafer level LED package structure and method for making the same | Bily Wang, Jack Chen | 2011-04-12 |