Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8748209 | Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same | Bily Wang, HUNG-CHOU YANG | 2014-06-10 |
| 8053904 | Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same | Bily Wang, HUNG-CHOU YANG | 2011-11-08 |