Issued Patents All Time
Showing 76–100 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2017-06-27 |
| 9659796 | Rinsing wafers using composition-tunable rinse water in chemical mechanical polish | Cheng-Hsun Chan | 2017-05-23 |
| 9653418 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Yi-Wen Wu | 2017-05-16 |
| 9601355 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |
| 9493678 | Polishing composition | Yun-Lung Ho, Chun-Chieh Lee, Song-Yuan Chang, Ming-Hui Lu | 2016-11-15 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu | 2016-10-18 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2016-08-30 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Yu-Feng Chen, De-Yuan Lu, Chung-Shi Liu | 2016-07-19 |
| 9373035 | Image capturing method for image recognition and system thereof | Ben Wu, Chih-Kao Chen | 2016-06-21 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2016-06-07 |
| 9263302 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2016-02-16 |
| 9257401 | Method of fabricating bump structure and bump structure | Chun-Lei Hsu, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9159686 | Crack stopper on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu | 2015-10-13 |
| 9117772 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2015-08-25 |
| 9111064 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2015-08-18 |
| 9099396 | Post-passivation interconnect structure and method of forming the same | Yi-Wen Wu, Zheng-Yi Lim, Chung-Shi Liu | 2015-08-04 |
| 9064880 | Zero stand-off bonding system and method | Chun-Hung Lin, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2015-06-23 |
| 9030010 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Yi-Wen Wu | 2015-05-12 |
| 8993431 | Method of fabricating bump structure | Chun-Lei Hsu, Ming-Da Cheng, Chung-Shi Liu | 2015-03-31 |
| 8981559 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Chung-Shi Liu, De-Yuan Lu, Yu-Feng Chen | 2015-03-17 |
| 8937388 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2015-01-20 |
| 8865586 | UBM formation for integrated circuits | Yi-Wen Wu, Zheng-Yi Lim, Chung-Shi Liu | 2014-10-21 |
| 8865585 | Method of forming post passivation interconnects | Meng-Wei Chou, Hung-Jui Kuo, Chung-Shi Liu | 2014-10-21 |