HM

Hsien-Liang Meng

TSMC: 10 patents #2,782 of 12,232Top 25%
UM United Microelectronics: 3 patents #1,523 of 4,560Top 35%
UI United Silicon Incorporated: 3 patents #7 of 57Top 15%
MV Mosel Vitelic: 2 patents #107 of 482Top 25%
📍 Baoshan, TW: #177 of 3,661 inventorsTop 5%
Overall (All Time): #253,890 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
11211261 Package structures and methods for forming the same Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more 2021-12-28
11088109 Packages with multi-thermal interface materials and methods of fabricating the same Chih-Hao Lin, Chien-Kuo Chang, Pu-Sheng Lee, Fu-Jen Li 2021-08-10
10872831 Method of forming a semiconductor package Ying-Shin Han, Yen-Miao LIN, Chung-Chih Chen 2020-12-22
10269669 Semiconductor package and method of forming the same Ying-Shin Han, Yen-Miao LIN, Chung-Chih Chen 2019-04-23
10049894 Package structures and methods for forming the same Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more 2018-08-14
9418956 Zero stand-off bonding system and method Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Han-Ping Pu 2016-08-16
9362236 Package structures and methods for forming the same Wei-Hung Lin, Jimmy Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more 2016-06-07
9129878 Mechanisms for forming backside illuminated image sensor device structure Bo-Chang Su, Chih-Ho Tai, Wei-Chih Weng, Hsun-Ying Huang 2015-09-08
9127356 Sputtering target with reverse erosion profile surface and sputtering system and method using the same Chia-Liang Chueh, Kuo-Chou Chen, Ren-Dou Lee, Chun-Wei Lin 2015-09-08
9064880 Zero stand-off bonding system and method Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Han-Ping Pu 2015-06-23
7402496 Complementary metal-oxide-semiconductor device and fabricating method thereof Che-Hung Liu, Po-Lun Cheng, Chun-An Lin, Li-Yuen Tang, Hung-Lin Shih +2 more 2008-07-22
7288828 Metal oxide semiconductor transistor device Huan-Shun Lin, Chen-Hua Tsai, Wei-Tsun Shiau, Hung-Lin Shih 2007-10-30
6225189 Method of fabricating shallow trench isolation structure Chun-Liang Liu 2001-05-01
6204147 Method of manufacturing shallow trench isolation Chun-Liang Liu, Shih-Ming Lan 2001-03-20
6187692 Method for forming an insulating film Shih-Ming Lan, Chun-Liang Liu, Andrew Lin 2001-02-13
6124204 Method of removing copper oxide within via hole Shih-Ming Lan, Ho-Sung Liao 2000-09-26
5963830 Method of forming a TiN/W barrier layer for a hot Al plug Pei-Jan Wang, Yeong-Ruey Shiue, Yung-Tsun Lo 1999-10-05
5770515 Method of in-situ wafer cooling for a sequential WSI/alpha -Si sputtering process Elvis Huang, Pei-Jan Wang, Yeong Rvey Shiue 1998-06-23