Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872831 | Method of forming a semiconductor package | Ying-Shin Han, Chung-Chih Chen, Hsien-Liang Meng | 2020-12-22 |
| 10269669 | Semiconductor package and method of forming the same | Ying-Shin Han, Chung-Chih Chen, Hsien-Liang Meng | 2019-04-23 |