Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699673 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Jr-Lin Hsu | 2023-07-11 |
| 11011487 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Jr-Lin Hsu | 2021-05-18 |
| 10872831 | Method of forming a semiconductor package | Ying-Shin Han, Yen-Miao LIN, Hsien-Liang Meng | 2020-12-22 |
| 10700030 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Jr-Lin Hsu | 2020-06-30 |
| 10601677 | Device and method for a dynamic virtual private network and computer readable recording medium | Shi-Ming Zhao | 2020-03-24 |
| 10269669 | Semiconductor package and method of forming the same | Ying-Shin Han, Yen-Miao LIN, Hsien-Liang Meng | 2019-04-23 |
| 9781857 | Hot swappable component quick release | Maw-Zan Jau, Chao-Jung Chen, Chih-Ming Chen, Chi-Fu Chen | 2017-10-03 |
| 8831021 | System and method for dynamically configurable multi-window divergent protocol bridge | Vinoth Kumar Deivasigamani, Brent Gene Duckering | 2014-09-09 |
| 8242712 | Power supply apparatus | Wen-Sheng Chen, Yeh Guan | 2012-08-14 |
| 7709878 | Capacitor structure having butting conductive layer | — | 2010-05-04 |
| 7257431 | Electric swiveling mechanism for two axes | Shao-Wen Kao, Chih-Chuan Ke, Zheng-Kai Hu | 2007-08-14 |
| 6500355 | Wafer conductive structure for preventing plasma damage | — | 2002-12-31 |
| 6251804 | Method for enhancing adhesion of photo-resist to silicon nitride surfaces | — | 2001-06-26 |