Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7410835 | Method for fabricating semiconductor package with short-prevented lead frame | Chin-Teng Hsu, Chen-Hsiung Yang, Chih-Jen Yang | 2008-08-12 |
| 7008826 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chien-Ping Huang, Chin-Yuan Hong, Chin-Teng Hsu | 2006-03-07 |
| 6979886 | Short-prevented lead frame and method for fabricating semiconductor package with the same | Chin-Teng Hsu, Cheng-Hsiung Yang, Chih-Jen Yang | 2005-12-27 |
| 6806565 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chien-Ping Huang, Chin-Yuan Hong, Chin-Teng Hsu | 2004-10-19 |
| 6680531 | Multi-chip semiconductor package | Chin-Teng Hsu, Fu-Di Tung, Chen-Shih Yu, Chin-Yuan Hung | 2004-01-20 |
| 6437447 | Dual-sided chip package without a die pad | Chien-Ping Huang, Chin-Yuan Hung, Chang-Fu Chen, Jenn-Shyh Yu | 2002-08-20 |