Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696749 | Package structure having tapering support bars and leads | Lien-Chen Chiang | 2004-02-24 |
| 6680531 | Multi-chip semiconductor package | Chin-Teng Hsu, Fu-Di Tung, Chen-Shih Yu, Jui-Hsiang Hung | 2004-01-20 |
| 6509636 | Semiconductor package | Yueh-Ying Tsai, Chang-Fu Chen | 2003-01-21 |
| 6495908 | Multi-chip semiconductor package | Cheng-Hsung Yang, Jian LIU | 2002-12-17 |
| 6476469 | Quad flat non-leaded package structure for housing CMOS sensor | Lien-Chen Chiang, Cheng-Shiu Hsiao | 2002-11-05 |
| 6476474 | Dual-die package structure and method for fabricating the same | — | 2002-11-05 |
| 6437447 | Dual-sided chip package without a die pad | Chien-Ping Huang, Chang-Fu Chen, Jenn-Shyh Yu, Jui-Hsiang Hung | 2002-08-20 |
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chang-Fu Chen, Fu Tang | 2002-05-28 |