Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289409 | Method for fabricating carrier-free semiconductor package | Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2022-03-29 |
| 10566271 | Carrier-free semiconductor package and fabrication method | Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2020-02-18 |
| 9257311 | Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion | Shih-Yao Liu, Yong Chen | 2016-02-09 |
| 9190296 | Fabrication method of semiconductor package without chip carrier | Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2015-11-17 |
| 9029203 | Method of fabricating semiconductor package | Pang-Chun Lin, Yong Chen | 2015-05-12 |
| 8975734 | Semiconductor package without chip carrier and fabrication method thereof | Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2015-03-10 |
| 8525336 | Semiconductor package and method of fabricating the same | Pang-Chun Lin, Yong Chen | 2013-09-03 |
| 6509636 | Semiconductor package | Chin-Yuan Hung, Chang-Fu Chen | 2003-01-21 |
| 6424024 | Leadframe of quad flat non-leaded package | Bor Shiun Shih | 2002-07-23 |