Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476199 | Package structure | Yi-Cheng Lin, Chun-Ming Chiu, Hung-Chih Lee | 2022-10-18 |
| 11153963 | Circuit carrier structure and manufacturing method thereof | Ho-Shing Lee, Chien-Chen Lin | 2021-10-19 |
| 10978401 | Package structure | Yi-Cheng Lin, Chun-Ming Chiu, Hung-Chih Lee | 2021-04-13 |
| 10825599 | Carrier structure | Chun-Hao Chen, Kuan-Hsi Wu, Pi-Te Pan | 2020-11-03 |
| 10383226 | Multi-layer circuit structure and manufacturing method thereof | Chun-Hao Chen | 2019-08-13 |
| 9775246 | Circuit board and manufacturing method thereof | Kuan-Hsi Wu, Pi-Te Pan | 2017-09-26 |
| 9559045 | Package structure and method for manufacturing the same | Pi-Te Pan | 2017-01-31 |
| 8893379 | Manufacturing method of package structure | Shih-Hao Sun | 2014-11-25 |
| 8420951 | Package structure | Shih-Hao Sun | 2013-04-16 |
| 7964106 | Method for fabricating a packaging substrate | — | 2011-06-21 |
| D577490 | Suitcase | — | 2008-09-30 |
| 7135642 | Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier | C. F. Wang | 2006-11-14 |
| 6509636 | Semiconductor package | Yueh-Ying Tsai, Chin-Yuan Hung | 2003-01-21 |
| 6437447 | Dual-sided chip package without a die pad | Chien-Ping Huang, Chin-Yuan Hung, Jenn-Shyh Yu, Jui-Hsiang Hung | 2002-08-20 |
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chin-Yuan Hung, Fu Tang | 2002-05-28 |