Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342704 | Signal connector positioning structure and signal line fabrication method | — | 2022-05-24 |
| 8333893 | Filtration separation method for waste resin containing highly radioactive uranium powder and device thereof | Kuo-Yuan Chang, Ling-Huan Chiao, Chin-Chun Chu Ko, Bing-Rong Wu | 2012-12-18 |
| 8299977 | Shock- and moisture-resistant connector assembly | — | 2012-10-30 |
| 7530842 | High-frequency connector assembly | — | 2009-05-12 |
| 7416416 | High frequency connector | — | 2008-08-26 |
| 7410835 | Method for fabricating semiconductor package with short-prevented lead frame | Jui-Hsiang Hung, Chen-Hsiung Yang, Chih-Jen Yang | 2008-08-12 |
| 7217160 | Adapter for high frequency signal transmission | — | 2007-05-15 |
| 7126229 | Wire-bonding method and semiconductor package using the same | Ming-Chun Laio, Holman Chen, Chun-Yuan Li, Fu Tang | 2006-10-24 |
| 7008826 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chien-Ping Huang, Chin-Yuan Hong, Jui-Hsiang Hung | 2006-03-07 |
| 6979886 | Short-prevented lead frame and method for fabricating semiconductor package with the same | Jui-Hsiang Hung, Cheng-Hsiung Yang, Chih-Jen Yang | 2005-12-27 |
| 6806565 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chien-Ping Huang, Chin-Yuan Hong, Jui-Hsiang Hung | 2004-10-19 |
| 6680531 | Multi-chip semiconductor package | Fu-Di Tung, Chen-Shih Yu, Jui-Hsiang Hung, Chin-Yuan Hung | 2004-01-20 |