Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7230323 | Ground-enhanced semiconductor package and lead frame for the same | Yi-Shiung Lee, Chun-Yuan Li, Shih-Tsun Huang, Chih-Yung Yun | 2007-06-12 |
| 7126229 | Wire-bonding method and semiconductor package using the same | Chin-Teng Hsu, Ming-Chun Laio, Chun-Yuan Li, Fu Tang | 2006-10-24 |
| 7008826 | Lead-frame-based semiconductor package and fabrication method thereof | Chien-Ping Huang, Chin-Yuan Hong, Jui-Hsiang Hung, Chin-Teng Hsu | 2006-03-07 |
| 6806565 | Lead-frame-based semiconductor package and fabrication method thereof | Chien-Ping Huang, Chin-Yuan Hong, Jui-Hsiang Hung, Chin-Teng Hsu | 2004-10-19 |