Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7126229 | Wire-bonding method and semiconductor package using the same | Chin-Teng Hsu, Holman Chen, Chun-Yuan Li, Fu Tang | 2006-10-24 |
| 6696750 | Semiconductor package with heat dissipating structure | Cha-Yun Yin, Fu Tang, Chien-Ping Huang | 2004-02-24 |