Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809408 | Semiconductor package with die pad having recessed portion | Chih-Jen Yang, Hung Jui-Hsiang, Chin Jeng Liu, Chen Yang | 2004-10-26 |
| 6680531 | Multi-chip semiconductor package | Chin-Teng Hsu, Fu-Di Tung, Jui-Hsiang Hung, Chin-Yuan Hung | 2004-01-20 |