Issued Patents All Time
Showing 51–75 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842785 | Apparatus and method for verification of bonding alignment | Ping-Yin Liu, Lan-Lin Chao | 2017-12-12 |
| 9834435 | Structure and formation method of semiconductor device structure | Ping-Yin Liu, Yeong-Jyh Lin, Jung-Huei Peng | 2017-12-05 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-29 |
| 9741681 | Debonding schemes | Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-22 |
| 9735033 | Multiple swivel arm design in hybrid bonder | Ping-Yin Liu, Lan-Lin Chao | 2017-08-15 |
| 9704820 | Semiconductor manufacturing method and associated semiconductor manufacturing system | Yung-Lung Lin, Ping-Yin Liu, Chia-Shiung Tsai | 2017-07-11 |
| 9684353 | Wearable equipment and mode switching method using the same | Xiao Xu | 2017-06-20 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xiaomeng Chen, Ping-Yin Liu, Lan-Lin Chao | 2017-05-09 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao +2 more | 2017-01-03 |
| 9527188 | Grinding wheel for wafer edge trimming | Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-12-27 |
| 9508586 | Debonding schemes | Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| D770617 | Endoscope system workstation | Ye Hong, Junwei Xu, Han Xu, Tengfei Yang | 2016-11-01 |
| 9478471 | Apparatus and method for verification of bonding alignment | Ping-Yin Liu, Lan-Lin Chao | 2016-10-25 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-09-13 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Hsun-Chung Kuang, Cheng-Tai Hsiao, Lan-Lin Chao | 2016-08-23 |
| 9385010 | Multiple swivel arm design in hybrid bonder | Ping-Yin Liu, Lan-Lin Chao | 2016-07-05 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Chih-Hui Huang, Lan-Lin Chao, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9293303 | Low contamination chamber for surface activation | Ping-Yin Liu, Lee-Chuan Tseng, Lan-Lin Chao | 2016-03-22 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Lan-Lin Chao +3 more | 2015-09-22 |
| 9054121 | MEMS structures and methods for forming the same | Ping-Yin Liu, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao +2 more | 2015-06-09 |
| 9048283 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2015-06-02 |