Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202724 | Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2025-01-21 |
| 12074110 | Method for manufacturing semiconductor device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2024-08-27 |
| 11772960 | Method of forming dielectric and metal sealing layers on capping structure of a MEMs device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2023-10-03 |
| 11462478 | Layer for buffer semiconductor device including microelectromechnical system (MEMS) device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2022-10-04 |
| 10961114 | Semiconductor structure and manufacturing method for the same | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2021-03-30 |