Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10526196 | Structure and formation method of semiconductor device structure | Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng | 2020-01-07 |
| 10508023 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2019-12-17 |
| 10155659 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Hung-Chia Tsai, Chia-Hua Chu | 2018-12-18 |
| 9919914 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2018-03-20 |
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Hung-Chia Tsai, Chia-Hua Chu | 2017-10-03 |
| 9673169 | Method and apparatus for a wafer seal ring | Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung, Yao-Te Huang +1 more | 2017-06-06 |
| 9656852 | CMOS-MEMS device structure, bonding mesa structure and associated method | Chun-Wen Cheng | 2017-05-23 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2017-04-11 |
| 9567208 | Semiconductor device and method for fabricating the same | Chun-Wen Cheng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Wei Lin | 2017-02-14 |
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Chin-Yi Cho, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Jung-Huei Peng | 2017-01-17 |
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2016-10-18 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2016-05-31 |
| 9269679 | Wafer level packaging techniques | Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9238578 | Semiconductor arrangement with stress release and thermal insulation | Chun-Wen Cheng, Chia-Hua Chu | 2016-01-19 |
| 9150404 | Semiconductor device with through molding vias | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2015-10-06 |
| 9130531 | Semiconductor arrangement with thermal insulation configuration | Chun-Wen Cheng, Chia-Hua Chu | 2015-09-08 |
| 9114976 | Semiconductor arrangement with stress release configuration | Chun-Wen Cheng, Chia-Hua Chu | 2015-08-25 |
| 8941152 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2015-01-27 |
| 8841201 | Systems and methods for post-bonding wafer edge seal | Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Lin-Min Hung, Yao-Te Huang +1 more | 2014-09-23 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang +1 more | 2014-04-01 |
| 6349142 | Structure of speaker use on ship | — | 2002-02-19 |